Burn-In & Aging Test:
Extended high-load operation to identify potential early-life component failures (infant mortality). This process guarantees long-term stability and significantly reduces after-sales maintenance costs for your brand.

Thermal Shock Test:
Subjecting products to rapid transitions between extreme high and low temperatures to verify the durability of solder joints and material integrity under harsh environmental stress.

Aging & ESS Test:
We conduct Environmental Stress Screening (ESS) to expose latent defects in components and solder joints. By simulating long-term operation under controlled stress, we eliminate early-life failures and ensure the highest field reliability.

Automated Optical Inspection (AOI):
Utilizing high-speed precision cameras to detect soldering defects, missing components, or polarity errors, ensuring zero-defect assembly during the SMT process.

Specialized Telephone Tester:
Dedicated testing for telecommunication and voice devices to ensure signal stability, audio quality, and dialing accuracy.



Cable & Harness Reliability:
Comprehensive electrical and tensile strength testing to ensure every wire harness meets rigorous industrial standards.